A study on transmission characteristic of signal line with solder-mount on a PCB

Hiroshi Inoue, Ken Ichi Takahashi

    研究成果: Conference contribution

    抄録

    As a fundamental study of the high frequency printed circuit or wire-bonding, the transmission characteristics and magnetic near field intensity distribution for the modeled printed circuit board (PCB), which have the soldered thin wire line are investigated experimentally. The size of a modeled sample is 30 × 50 mm2 using 1.53 mm glass-epoxy substrate. Basic signal line constructed as 50-ohm characteristic impedance. The soldered thin wire line of 100-micrometer diameter was fabricated at the center of the modeled PCB that simulates the bonding part. S-parameters, i.e. |S21| and |S11|, characteristic impedance measured by the time domain reflectometry and magnetic near field distribution measured by a shielded loop probe are discussed. The length of the thin wire and shape of the strip line and wire-bonding part have significant influence to the characteristic impedance, transmission property and magnetic distribution properties. These results offer the design ways and guidelines for the PCB and parts designing and wiring including solder mounted element and also wire bonding packaging at high frequency applications.

    本文言語English
    ホスト出版物のタイトルProceedings of the 50th IEEE Holm Conference on Electrical Contacts and the 22nd International Conference on Electrical Contacts
    ページ176-183
    ページ数8
    出版ステータスPublished - 2004 12月 1
    イベントProceedings of the 50th IEEE Holm Conference on Electrical Contacts and the 22nd International Conference on Electrical Contacts - Seattle, WA, United States
    継続期間: 2004 9月 202004 9月 23

    出版物シリーズ

    名前Proceedings of the 50th IEEE Holm Conference on Electrical Contacts and the 22nd International Conference on Electrical Contacts

    Conference

    ConferenceProceedings of the 50th IEEE Holm Conference on Electrical Contacts and the 22nd International Conference on Electrical Contacts
    国/地域United States
    CitySeattle, WA
    Period04/9/2004/9/23

    ASJC Scopus subject areas

    • 工学(全般)

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