A novel approach for increasing the strength of an Au/Si eutectic bonded interface on an oxidized silicon surface

M. Haubold, Y. C. Lin, J. Frömel, M. Wiemer, M. Esashi, T. Geßner

    研究成果: Article査読

    2 被引用数 (Scopus)

    抄録

    The use of tantalum as adhesion layer for Au/Si eutectic bonding was investigated and compared to the frequently used materials chromium or titanium in the case of oxidized silicon substrates. Suitable test structures have been fabricated, bonded and evaluated. The eutectically bonded chips were characterized in respect to the maximum bearable tensile and shear loading. Interfacial reactions were observed by SEM and optical microscopy. As asignificant result when tantalum was used, the external load until fracture occurred could be increased up to a factor of 3 in comparison to usually applied chromium or titanium. Analyses after bonding gave no prove for diffusion between the metallic alloy and the adhesion layer and delamination could be minimized therefore.

    本文言語English
    ページ(範囲)515-521
    ページ数7
    ジャーナルMicrosystem Technologies
    18
    4
    DOI
    出版ステータスPublished - 2012 4月

    ASJC Scopus subject areas

    • 電子材料、光学材料、および磁性材料
    • 凝縮系物理学
    • ハードウェアとアーキテクチャ
    • 電子工学および電気工学

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