A method for seeking high thermal conductivity compounds

Yoshihiro Terada, Junji Nakata, Tetsuo Mohri, Tomoo Suzuki

研究成果: Article査読

7 被引用数 (Scopus)

抄録

Thermal conductivity of an intermetallic compound is characterized as an enhancement due to ordering with reference to the basic contribution of solid solutions. A necessary condition of having high thermal conductivity of a given intermetallic compound is, therefore, that the solid solution itself transports high thermal current. A periodic table in helical form for seeking the high conductivity compound is proposed by summarizing the electrical resistivity data of solid solutions. Assessments of thermal conductivity were conducted for the intermetallic compounds based on noble metals. Cu3Au, CuAu and AgMg show the maximum value for 157, 167 and 147 Wm-1 K-1 at ambient temperature among L12, L10 and B2 compounds, respectively.

本文言語English
ページ(範囲)479-485
ページ数7
ジャーナルIntermetallics
6
6
DOI
出版ステータスPublished - 1998

ASJC Scopus subject areas

  • Chemistry(all)
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys
  • Materials Chemistry

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