A method for nondestructive evaluation of crack depth on metal surface by microwaves

M. Saka, Yang Ju, Daying Luo, H. Abé

研究成果: Conference contribution

2 被引用数 (Scopus)

抄録

A microwave method to evaluate the depth of cracks on the metal surface is demonstrated. An open-ended coaxial line sensor was developed to improve the spatial resolution for detection of small 3D cracks. The amplitude of the reflection coefficient that is associated with the dimensions of the cracks is measured by scanning the specimen in the direction perpendicular to the detected crack. A characteristic signal corresponding to the detected crack was obtained and was used to evaluate the depth of cracks.

本文言語English
ホスト出版物のタイトル2000 25th International Conference on Infrared and Millimeter Waves - Conference Digest
編集者Shenggang Liu, Xuechu Shen, K. J. Button
出版社Institute of Electrical and Electronics Engineers Inc.
ページ423-424
ページ数2
ISBN(電子版)0780365135, 9780780365131
DOI
出版ステータスPublished - 2000
イベント25th International Conference on Infrared and Millimeter Waves, IRMMW 2000 - Beijing, China
継続期間: 2000 9 122000 9 15

出版物シリーズ

名前2000 25th International Conference on Infrared and Millimeter Waves - Conference Digest

Other

Other25th International Conference on Infrared and Millimeter Waves, IRMMW 2000
国/地域China
CityBeijing
Period00/9/1200/9/15

ASJC Scopus subject areas

  • 電子工学および電気工学
  • 器械工学
  • 放射線

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