TY - GEN
T1 - A Metadata Prefetching Mechanism for Hybrid Memory Architectures
AU - Tsukada, Shunsuke
AU - Takayashiki, Hikaru
AU - Sato, Masayuki
AU - Komatsu, Kazuhiko
AU - Kobayashi, Hiroaki
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021/4/14
Y1 - 2021/4/14
N2 - A hybrid memory, which is the main memory consisting of two distinct memory devices, is expected to achieve a good balance between high performance and large capacity. However, unlike a traditional memory, the hybrid memory needs the metadata for data management and requires additional access latency for their references. To hide the latency, this paper proposes a metadata prefetching mechanism considering the address differences to control the prefetching. The evaluation results show that the proposed mechanism increases the metadata hit rate in two-thirds of the examined benchmarks and improves IPC by up to 34% and 6% on average.
AB - A hybrid memory, which is the main memory consisting of two distinct memory devices, is expected to achieve a good balance between high performance and large capacity. However, unlike a traditional memory, the hybrid memory needs the metadata for data management and requires additional access latency for their references. To hide the latency, this paper proposes a metadata prefetching mechanism considering the address differences to control the prefetching. The evaluation results show that the proposed mechanism increases the metadata hit rate in two-thirds of the examined benchmarks and improves IPC by up to 34% and 6% on average.
KW - address difference
KW - hybrid memory architecture
KW - metadata
KW - performance
KW - prefetch
UR - http://www.scopus.com/inward/record.url?scp=85105527647&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85105527647&partnerID=8YFLogxK
U2 - 10.1109/COOLCHIPS52128.2021.9410321
DO - 10.1109/COOLCHIPS52128.2021.9410321
M3 - Conference contribution
AN - SCOPUS:85105527647
T3 - IEEE Symposium in Low-Power and High-Speed Chips, COOL CHIPS 2021 - Proceedings
BT - IEEE Symposium in Low-Power and High-Speed Chips, COOL CHIPS 2021 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 24th IEEE Symposium in Low-Power and High-Speed Chips, COOL CHIPS 2021
Y2 - 14 April 2021 through 16 April 2021
ER -