7-μm-thick NCF technology with low-height solder microbump bonding for 3D integration

Yuki Miwa, Kousei Kumahara, Sungho Lee, Rui Liang, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

研究成果: Conference contribution

抄録

High-density interconnections are highly required for 3D IC such as FPGA and image sensor applications. Fine-pitch interconnects using conventional solder microbumps are still required. To meet this requirements, low-height Cu/Sn microbumps are evaluated in this study. The thermal compression bonding with the low-height solder microbumps makes it challenging to fulfill high-viscous capillary underfill (CUF) into extremely small gaps between the chips stacked in layers. Here, we demonstrate to apply a 7-μm-thick non-conductive film (NCF) to flip-chip bonding with the low-height solder microbumps. Compared with a CUF, the electrical characterization such as electromigration (EM) and leakage current of microbump daisy chains with the ultra-thin NCF was investigated with temperature cycle test (TCT) and unbiased HAST.

本文言語English
ホスト出版物のタイトルProceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020
出版社Institute of Electrical and Electronics Engineers Inc.
ページ1453-1458
ページ数6
ISBN(電子版)9781728161808
DOI
出版ステータスPublished - 2020 6
イベント70th IEEE Electronic Components and Technology Conference, ECTC 2020 - Orlando, United States
継続期間: 2020 6 32020 6 30

出版物シリーズ

名前Proceedings - Electronic Components and Technology Conference
2020-June
ISSN(印刷版)0569-5503

Conference

Conference70th IEEE Electronic Components and Technology Conference, ECTC 2020
国/地域United States
CityOrlando
Period20/6/320/6/30

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学

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