60GHz antenna integrated transmitter module using 3-D SiP technology and organic substrates

Noriharu Suematsu; Satoshi Yoshida; Shoichi Tanifuji; Suguru Kameda; Tadashi Takagi; Kazuo Tsubouchi

60GHz antenna integrated transmitter module using 3-D SiP technology and organic substrates

Noriharu Suematsu, Satoshi Yoshida, Shoichi Tanifuji, Suguru Kameda, Tadashi Takagi, Kazuo Tsubouchi

電気通信研究所・ブロードバンド工学研究部門

研究成果: Conference contribution

5 被引用数 (Scopus)

抄録

A low cost, ultra small antenna integrated wireless transceiver is one of the key technologies for short range millimeter-wave wireless communication. A RF module with integrated antenna will be presented. It consists of low cost organic multi-layer substrates and MMICs. The substrates are vertically stacked by employing Cu ball bonding 3-D system in package (SiP) technology and MMIC's are mounted on the organic substrates by using stud bump bonding (SBB) technique. The antenna performance with RF module will be presented. The results show the feasibility of millimeter-wave low cost, ultra small antenna integrated module using organic substrates.

本文言語	English
ホスト出版物のタイトル	European Microwave Week 2011
ホスト出版物のサブタイトル	"Wave to the Future", EuMW 2011, Conference Proceedings - 41st European Microwave Conference, EuMC 2011
ページ	551-554
ページ数	4
出版ステータス	Published - 2011 12月 1
イベント	14th European Microwave Week 2011: "Wave to the Future", EuMW 2011 - 41st EuropeanMicrowave Conference, EuMC 2011 - Manchester 継続期間: 2011 10月 10 → 2011 10月 13

Other

Other	14th European Microwave Week 2011: "Wave to the Future", EuMW 2011 - 41st EuropeanMicrowave Conference, EuMC 2011
City	Manchester
Period	11/10/10 → 11/10/13

ASJC Scopus subject areas

電子工学および電気工学

他のファイルとリンク

引用スタイル

Suematsu, N, Yoshida, S, Tanifuji, S, Kameda, S, Takagi, T & Tsubouchi, K 2011, 60GHz antenna integrated transmitter module using 3-D SiP technology and organic substrates. in European Microwave Week 2011: "Wave to the Future", EuMW 2011, Conference Proceedings - 41st European Microwave Conference, EuMC 2011., 6101998, pp. 551-554, 14th European Microwave Week 2011: "Wave to the Future", EuMW 2011 - 41st EuropeanMicrowave Conference, EuMC 2011, Manchester, 11/10/10.

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title = "60GHz antenna integrated transmitter module using 3-D SiP technology and organic substrates",

abstract = "A low cost, ultra small antenna integrated wireless transceiver is one of the key technologies for short range millimeter-wave wireless communication. A RF module with integrated antenna will be presented. It consists of low cost organic multi-layer substrates and MMICs. The substrates are vertically stacked by employing Cu ball bonding 3-D system in package (SiP) technology and MMIC's are mounted on the organic substrates by using stud bump bonding (SBB) technique. The antenna performance with RF module will be presented. The results show the feasibility of millimeter-wave low cost, ultra small antenna integrated module using organic substrates.",

keywords = "Antenna Integration, Millimeter-wave, MMIC, Module, RFIC, SiP, Stud bump",

author = "Noriharu Suematsu and Satoshi Yoshida and Shoichi Tanifuji and Suguru Kameda and Tadashi Takagi and Kazuo Tsubouchi",

year = "2011",

month = dec,

day = "1",

language = "English",

isbn = "9782874870224",

pages = "551--554",

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T1 - 60GHz antenna integrated transmitter module using 3-D SiP technology and organic substrates

AU - Suematsu, Noriharu

AU - Yoshida, Satoshi

AU - Tanifuji, Shoichi

AU - Kameda, Suguru

AU - Takagi, Tadashi

AU - Tsubouchi, Kazuo

PY - 2011/12/1

Y1 - 2011/12/1

N2 - A low cost, ultra small antenna integrated wireless transceiver is one of the key technologies for short range millimeter-wave wireless communication. A RF module with integrated antenna will be presented. It consists of low cost organic multi-layer substrates and MMICs. The substrates are vertically stacked by employing Cu ball bonding 3-D system in package (SiP) technology and MMIC's are mounted on the organic substrates by using stud bump bonding (SBB) technique. The antenna performance with RF module will be presented. The results show the feasibility of millimeter-wave low cost, ultra small antenna integrated module using organic substrates.

AB - A low cost, ultra small antenna integrated wireless transceiver is one of the key technologies for short range millimeter-wave wireless communication. A RF module with integrated antenna will be presented. It consists of low cost organic multi-layer substrates and MMICs. The substrates are vertically stacked by employing Cu ball bonding 3-D system in package (SiP) technology and MMIC's are mounted on the organic substrates by using stud bump bonding (SBB) technique. The antenna performance with RF module will be presented. The results show the feasibility of millimeter-wave low cost, ultra small antenna integrated module using organic substrates.

KW - Antenna Integration

KW - Millimeter-wave

KW - MMIC

KW - Module

KW - RFIC

KW - SiP

KW - Stud bump

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AN - SCOPUS:84855774290

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BT - European Microwave Week 2011

T2 - 14th European Microwave Week 2011: "Wave to the Future", EuMW 2011 - 41st EuropeanMicrowave Conference, EuMC 2011

Y2 - 10 October 2011 through 13 October 2011

ER -

60GHz antenna integrated transmitter module using 3-D SiP technology and organic substrates

抄録

Other

ASJC Scopus subject areas

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