60GHz antenna integrated transmitter module using 3-D SiP technology and organic substrates

Noriharu Suematsu, Satoshi Yoshida, Shoichi Tanifuji, Suguru Kameda, Tadashi Takagi, Kazuo Tsubouchi

研究成果: Conference contribution

5 被引用数 (Scopus)

抄録

A low cost, ultra small antenna integrated wireless transceiver is one of the key technologies for short range millimeter-wave wireless communication. A RF module with integrated antenna will be presented. It consists of low cost organic multi-layer substrates and MMICs. The substrates are vertically stacked by employing Cu ball bonding 3-D system in package (SiP) technology and MMIC's are mounted on the organic substrates by using stud bump bonding (SBB) technique. The antenna performance with RF module will be presented. The results show the feasibility of millimeter-wave low cost, ultra small antenna integrated module using organic substrates.

本文言語English
ホスト出版物のタイトルEuropean Microwave Week 2011
ホスト出版物のサブタイトル"Wave to the Future", EuMW 2011, Conference Proceedings - 41st European Microwave Conference, EuMC 2011
ページ551-554
ページ数4
出版ステータスPublished - 2011 12月 1
イベント14th European Microwave Week 2011: "Wave to the Future", EuMW 2011 - 41st EuropeanMicrowave Conference, EuMC 2011 - Manchester
継続期間: 2011 10月 102011 10月 13

Other

Other14th European Microwave Week 2011: "Wave to the Future", EuMW 2011 - 41st EuropeanMicrowave Conference, EuMC 2011
CityManchester
Period11/10/1011/10/13

ASJC Scopus subject areas

  • 電子工学および電気工学

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