Takehito Shimatsu

Scopus著者プロファイル

年別の研究成果

Pureに変更を加えた場合、すぐここに表示されます。

フィンガープリント

Takehito Shimatsuが活動している研究トピックを掘り下げます。このトピックラベルは、この研究者の研究成果に基づきます。これらがまとまってユニークなフィンガープリントを構成します。

1 類似のプロファイル

2304 被引用数
24 h-index
132 Article
51 Conference contribution
35 Conference article
2 Comment/debate
その他

Atomic diffusion bonding of wafers with oxide underlayers using thin Hf films for optical applications
Yonezawa, G., Uomoto, M. & Shimatsu, T., 2021 10 5, 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021. Institute of Electrical and Electronics Engineers Inc., p. 52 1 p. (2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021).
研究成果: Conference contribution
Atomic diffusion bonding using AIN films
Uomoto, M., Yoshida, H., Shimatsu, T., Saito, T., Moriwaki, T., Kato, N., Miyamoto, Y. & Miyamoto, K., 2021 10 5, 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021. Institute of Electrical and Electronics Engineers Inc., p. 45 1 p. (2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021).
研究成果: Conference contribution
Atomic diffusion bonding using Y₂O₃ and ZrO₂ films
Shimatsu, T., Yoshida, H., Uomoto, M., Saito, T., Monwaki, T., Kato, N., Miyamoto, Y. & Miyamoto, K., 2021 10 5, 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021. Institute of Electrical and Electronics Engineers Inc., p. 51 1 p. (2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021).
研究成果: Conference contribution
Bonding performance and interface contamination in atomic diffusion bonding of wafers using ti thin films
Amino, T., Uomoto, M. & Shimatsu, T., 2021, In: ECS Journal of Solid State Science and Technology. 10, 5, 054008.
研究成果: Article › 査読
1 被引用数 (Scopus)
First Demonstration of a High-Speed and High-Power-Tolerance InGaAs/Si Photodiode Fabricated by Atomic Diffusion Bonding
Yamada, Y., Nada, M., Uomoto, M., Shimatsu, T., Nakajima, F. & Matsuzaki, H., 2021 2, In: Physica Status Solidi (A) Applications and Materials Science. 218, 3, 2000395.
研究成果: Article › 査読

島津武仁

フィンガープリント

ネットワーク

詳細を開く

Atomic diffusion bonding of wafers with oxide underlayers using thin Hf films for optical applications

Atomic diffusion bonding using AIN films

Atomic diffusion bonding using Y₂O₃ and ZrO₂ films

Bonding performance and interface contamination in atomic diffusion bonding of wafers using ti thin films

First Demonstration of a High-Speed and High-Power-Tolerance InGaAs/Si Photodiode Fabricated by Atomic Diffusion Bonding

島津 武仁

フィンガープリント

ネットワーク

研究成果

Atomic diffusion bonding of wafers with oxide underlayers using thin Hf films for optical applications

Atomic diffusion bonding using AIN films

Atomic diffusion bonding using Y2O3 and ZrO2 films

Bonding performance and interface contamination in atomic diffusion bonding of wafers using ti thin films

First Demonstration of a High-Speed and High-Power-Tolerance InGaAs/Si Photodiode Fabricated by Atomic Diffusion Bonding

島津武仁

Atomic diffusion bonding using Y₂O₃ and ZrO₂ films