年別の研究成果
年別の研究成果
フィンガープリント
Jichoru Beが活動している研究トピックを掘り下げます。このトピックラベルは、この研究者の研究成果に基づきます。これらがまとまってユニークなフィンガープリントを構成します。
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ネットワーク
国/地域レベルにおける最近の外部共同研究。点をクリックして詳細を開くか、または
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High aspect ratio through-silicon-via formation by using low-cost electroless-Ni as barrier and seed layers for 3D-LSI integration and packaging applications
Murugesan, M., Mori, K., Bea, J. C., Koyanagi, M. & Fukushima, T., 2020 4 1, In: Japanese journal of applied physics. 59, SG, SGGC02.研究成果: Article › 査読
3 被引用数 (Scopus) -
Nano Ni/Cu-TSVs with an Improved Reliability for 3D-IC Integration Application
Murugesan, M., Mori, K., Kojima, T., Hashimoto, H., Bea, J. C., Fukushima, T. & Koyanagi, M., 2020 8, 2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2020. Institute of Electrical and Electronics Engineers Inc., 9185397. (ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings; vol. 2020-August).研究成果: Conference contribution
2 被引用数 (Scopus) -
On-wafer thermomechanical characterization of a thin film polyimide formed by vapor deposition polymerization for through-silicon via applications: Comparison to plasma-enhanced chemical vapor deposition SiO2
Fukushima, T., Murugesan, M., Bea, J. C., Hashimoto, H., Kino, H., Tanaka, T. & Koyanagi, M., 2020 8 15, In: Journal of Polymer Science. 58, 16, p. 2248-2258 11 p.研究成果: Article › 査読
Open Access -
Fabrication and Morphological Characterization of Nano-Scale Interconnects for 3D-Integration
Mariappan, M., Koyanagi, M., Hashimoto, H., Bea, J. C. & Fukushima, T., 2019 10, IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019. Institute of Electrical and Electronics Engineers Inc., 9058849. (IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019).研究成果: Conference contribution
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Fully-filled, highly-reliable fine-pitch interposers with TSV aspect ratio >10 for future 3D-LSI/IC packaging
Murugesan, M., Fukushima, T., Mori, K., Nakamura, A., Lee, Y., Motoyoshi, M., Bea, J. C., Watariguchi, S. & Koyanagi, M., 2019 5, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers Inc., p. 1047-1051 5 p. 8811299. (Proceedings - Electronic Components and Technology Conference; vol. 2019-May).研究成果: Conference contribution
8 被引用数 (Scopus)