年別の研究成果
年別の研究成果
フィンガープリント
Jichoru Beが活動している研究トピックを掘り下げます。このトピックラベルは、この研究者の研究成果に基づきます。これらがまとまってユニークなフィンガープリントを構成します。
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国/地域レベルにおける最近の外部共同研究。点をクリックして詳細を開くか、または
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Tight-Pitched 10 μm-Width Solder Joints for c-2-c and c-2-w 3D-Integration in NCF Environment
Mariappan, M., Fukuzumi, S., Shibata, T., Hashimoto, H., Bea, J. C., Koyanagi, M. & Fukushima, T., 2022, Proceedings - IEEE 72nd Electronic Components and Technology Conference, ECTC 2022. Institute of Electrical and Electronics Engineers Inc., p. 1138-1143 6 p. (Proceedings - Electronic Components and Technology Conference; vol. 2022-May).研究成果: Conference contribution
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Chip-to-chip/wafer three-dimensional integration of 2.5 mm-sized neuron and memory chips by via-last approach
Murugesan, M., Hashimoto, H., Bea, J., Koyanagi, M. & Fukushima, T., 2021 10月 5, 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021. Institute of Electrical and Electronics Engineers Inc., p. 28 1 p. (2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021).研究成果: Conference contribution
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Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing
Fukushima, T., Sakuyama, S., Takahashi, M., Hashimoto, H., Bea, J., Marcello, T., Kino, H., Tanaka, T., Koyanagi, M. & Mariappan, M., 2021, IEEE International 3D System Integration Conference, 3DIC 2021. Institute of Electrical and Electronics Engineers Inc., (IEEE International 3D System Integration Conference, 3DIC 2021).研究成果: Conference contribution
1 被引用数 (Scopus) -
High aspect ratio through-silicon-via formation by using low-cost electroless-Ni as barrier and seed layers for 3D-LSI integration and packaging applications
Murugesan, M., Mori, K., Bea, J. C., Koyanagi, M. & Fukushima, T., 2020 4月 1, In: Japanese journal of applied physics. 59, SG, SGGC02.研究成果: Article › 査読
5 被引用数 (Scopus) -
Nano Ni/Cu-TSVs with an Improved Reliability for 3D-IC Integration Application
Murugesan, M., Mori, K., Kojima, T., Hashimoto, H., Bea, J. C., Fukushima, T. & Koyanagi, M., 2020 8月, 2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2020. Institute of Electrical and Electronics Engineers Inc., 9185397. (ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings; vol. 2020-August).研究成果: Conference contribution
3 被引用数 (Scopus)