年別の研究成果
年別の研究成果
フィンガープリント
Jichoru Beが活動している研究トピックを掘り下げます。このトピックラベルは、この研究者の研究成果に基づきます。これらがまとまってユニークなフィンガープリントを構成します。
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研究成果
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High aspect ratio through-silicon-via formation by using low-cost electroless-Ni as barrier and seed layers for 3D-LSI integration and packaging applications
Murugesan, M., Mori, K., Bea, J. C., Koyanagi, M. & Fukushima, T., 2020 4 1, In: Japanese journal of applied physics. 59, SG, SGGC02.研究成果: Article › 査読
1 被引用数 (Scopus) -
Fabrication and Morphological Characterization of Nano-Scale Interconnects for 3D-Integration
Mariappan, M., Koyanagi, M., Hashimoto, H., Be, J. & Fukushima, T., 2019 10, IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019. Institute of Electrical and Electronics Engineers Inc., 9058849. (IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019).研究成果: Conference contribution
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Fully-filled, highly-reliable fine-pitch interposers with TSV aspect ratio >10 for future 3D-LSI/IC packaging
Murugesan, M., Fukushima, T., Mori, K., Nakamura, A., Lee, Y., Motoyoshi, M., Bea, J. C., Watariguchi, S. & Koyanagi, M., 2019 5, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers Inc., p. 1047-1051 5 p. 8811299. (Proceedings - Electronic Components and Technology Conference; vol. 2019-May).研究成果: Conference contribution
5 被引用数 (Scopus) -
Intra-and inter-chip electrical interconnection formed by directed self assembly of nanocomposite containing diblock copolymer and nanometal
Murugesan, M., Fukushima, T., Bea, J. C., Hashimoto, H. & Koyanagi, M., 2018 5 25, 2018 IEEE International Reliability Physics Symposium, IRPS 2018. Institute of Electrical and Electronics Engineers Inc., p. 4D.21-4D.27 (IEEE International Reliability Physics Symposium Proceedings; vol. 2018-March).研究成果: Conference contribution
1 被引用数 (Scopus) -
3-D Sidewall Interconnect Formation Climbing over Self-Assembled KGDs for Large-Area Heterogeneous Integration
Fukushima, T., Noriki, A., Bea, J., Murugesan, M., Kino, H., Kiyoyama, K., Ri, K., Tanaka, T. & Koyanagi, M., 2017 7, In: IEEE Transactions on Electron Devices. 64, 7, p. 2912-2918 7 p., 7935530.研究成果: Article › 査読
4 被引用数 (Scopus)