Zn-Al-Mg-Ga alloys as Pb-free solder for die-attaching use

T. Shimizu, H. Ishikawa, I. Ohnuma, K. Ishida

Research output: Contribution to journalArticle

101 Citations (Scopus)

Abstract

Zn-based alloys have been investigated to replace Pb-5% Sn solder for die-attaching use. We have found that a Zn-4%Al-3%Mg-3%Ga alloy has a 300 °C solidus and a 347 °C liquidus. A die-attaching test was done with preforms of this alloy, Ag-plated lead-frames, and Au-plated dummy dies. Good die-attaching with a small amount of voids can be achieved at 320 °C or higher. In subsequent reliability tests, no failure was observed until 1000 cycles between -65 °C and 150 °C or until 1000 h at 85 °C and 85% humidity. Although the poor workability and poor ability of stress relaxation at room temperature of this alloy may somewhat limit its application areas, this solder is the first Pb-free solder for die-attaching use to our knowledge.

Original languageEnglish
Pages (from-to)1172-1175
Number of pages4
JournalJournal of Electronic Materials
Volume28
Issue number11
DOIs
Publication statusPublished - 1999 Nov

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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