Abstract
YAG laser-assisted etching techniques were developed and investigated for releasing silicon microstructures. Gases, including HCI, SFe and NF3 were used for silicon etching. These produce volatile exhaust at atmospheric pressure. yag laser-assisted etching was applied to fabricate an electrostatic micraactualor, resonating sensors and accelerometers. This resistless dry etching can be applied to three-dimensional microstructures.
Original language | English |
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Pages (from-to) | 81-86 |
Number of pages | 6 |
Journal | Journal of Micromechanics and Microengineering |
Volume | 3 |
Issue number | 2 |
DOIs | |
Publication status | Published - 1993 Jan 1 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Mechanics of Materials
- Mechanical Engineering
- Electrical and Electronic Engineering