YAG laser assisted etching for releasing silicon micro structure

Kazuyuki Minami, Yuji Wakabayashi, Takeshi Matsubara, Kenichi Yoshimi, Masayuki Yoshida, Masayoshi Esashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Citations (Scopus)

Abstract

YAG laser assisted etching techniques were developed and investigated for releasing silicon micro structures. HCl, SF6 etc., which produce volatile exhaust, were used as etching gas at atmospheric pressure. The YAG laser assisted etching was applied to fabricate an electrostatic microactuator, a resonating sensor and accelerometers. This resistless dry etching can be applied to three-dimensional structures.

Original languageEnglish
Title of host publicationIEEE Micro Electro Mechanical Systems
PublisherPubl by IEEE
Pages53-58
Number of pages6
ISBN (Print)0780309588
Publication statusPublished - 1993 Jan 1
EventProceedings of the 1993 IEEE Micro Electro Mechanical Systems - MEMS - Fort Lauderdale, FL, USA
Duration: 1993 Feb 71993 Feb 10

Publication series

NameIEEE Micro Electro Mechanical Systems

Other

OtherProceedings of the 1993 IEEE Micro Electro Mechanical Systems - MEMS
CityFort Lauderdale, FL, USA
Period93/2/793/2/10

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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