X-ray study of residual stress distribution of ground ceramics

Yoshihisa Sakaida, Keisuke Tanaka, Yuichi Ikuhara, Kenzi Suzuki

    Research output: Contribution to journalArticlepeer-review

    Abstract

    The residual stress distribution of ground ceramics was determined from the eigen strain existing in the ground surface. The eigen strain of ground ceramics was tensile, and exponentially decreased with the distance from the surface. The residual stress distribution is given as a superposition of an exponential function of compression and a linear function. It is found that the actual residual stress distribution can be approximated by a compressive exponential function because the magnitude of tensile residual stress is negligibly small compared to the compressive residual stress. In the experiments, the diffraction angle was measured on ground silicon nitride for a wide range of sin2ψ using the glancing incidence X-ray diffraction technique. A strong nonlinearity was found in the 2θ-sin2ψ diagram at very high ψ-angles. From the analysis of nonlinearity, the residual stress distribution was determined. The residual stress distribution of silicon nitride coincided with the distribution calculated from the eigen strain distribution. Transmission electron microscopy was used to clarify the origin of generation of the residual stress. Both strain contrasts and microcracks were observed below the ground surface; straight dislocations were also observed within silicon nitride grains near the ground surface.

    Original languageEnglish
    Pages (from-to)1681-1687
    Number of pages7
    JournalNippon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A
    Volume63
    Issue number612
    DOIs
    Publication statusPublished - 1997

    ASJC Scopus subject areas

    • Materials Science(all)
    • Mechanics of Materials
    • Mechanical Engineering

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