Abstract
An SiO2/Si-cap/Si0.55Ge0.45 heterostructure was fabricated on p-type Si(100) and strained silicon on insulator (SOI) substrates by low pressure chemical vapor deposition (LPCVD) and subsequent thermal oxidation in an O2 + H2 gas mixture. Chemical bonding features and valence band offsets in the heterostructures were evaluated by using highresolution x-ray photoelectron spectroscopy (XPS) measurements and thinning the stack layers with a wet chemical solution.
Original language | English |
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Pages (from-to) | 680-685 |
Number of pages | 6 |
Journal | IEICE Transactions on Electronics |
Volume | E96-C |
Issue number | 5 |
DOIs | |
Publication status | Published - 2013 May |
Keywords
- Chemical bonding features
- Heterostructure
- Silicon germanium
- Valence band alignment
- X-ray photoelectron spectroscopy
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering