Working fluid sealing method for vapor chamber type micro thermal diode

Research output: Contribution to journalArticlepeer-review


This paper reports a method to encapsulate degassed working fluid in a vapor chamber type micro thermal diode. Degassing and sealing processes were sequentially done in a same vacuum chamber. The pressure in the device, measured by a zero-balance method, was as low as 7000 Pa, and the pressure was kept for at least 500 hours. The thermal resistance in the reverse heat flow mode was about 30% higher than that in the forward mode.

Original languageEnglish
Pages (from-to)392-393
Number of pages2
JournalIEEJ Transactions on Sensors and Micromachines
Issue number8
Publication statusPublished - 2018 Jan 1


  • Drop-wise condensation
  • Micro heat management
  • Power MEMS
  • Thermal diode
  • Vapor chamber

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering


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