Wiring implanted by laser-assisted powder jet using copper microparticles

Katsuhiko Suzuki, Manabu Miura, Asahi Konno, Kaichi Miura, Tetsuo Yuzawa, Masanao Watanab, Tsunemoto Kuriyagawa

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)


It has been confirmed that copper particles can be implanted into a poly(oxymethylene) thermoplastic resin substrate by using a laser-assisted powder jet and copper wiring can be formed. Irradiating the laser on the substrate, copper powder with a particle size of 1 or 1.5 μm was jetted using Ar gas, and was implanted into the substrate. A green laser of CW type with a power of 200mW and a spot radius of 2.5mm was condensed at the same spot as the powder jetted on the substrate using a focal length of 50 mm. The smallest wiring width of about 90 μm was formed by the laser-assisted powder jet of 1 μm particles at 0.3 MPa. The depth of the formed wiring increased, and its width and the resistivity decreased, as the number of repetitions of the wiring process increased under the conditions of a powder jet of 0.6 MPa formed using 1.5 μm particles. The smallest resistivity and the largest implantation depth were 0.31 μΩ·m and 75 μm for 5 repetitions, respectively.

Original languageEnglish
Pages (from-to)06GN091-06GN094
JournalJapanese journal of applied physics
Issue number6 PART 2
Publication statusPublished - 2010 Jun

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

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