TY - JOUR
T1 - Wetting characteristics of Sn-Ag-Cu solder on Pd-based metallic glass
AU - Nishikawa, Hiroshi
AU - WongPiromsarn, Krit
AU - Abe, Hiroya
AU - Takemoto, Tadashi
AU - Fukuhara, Mikio
AU - Wada, Takeshi
AU - Inoue, Akihisa
N1 - Funding Information:
This work was supported by Grant-in-Aid for Cooperative Research Project of Nationwide Joint-Use Research Institute on Development Base of Joining Technology for New Metallic Glasses and Inorganic Materials from The Ministry of Education, Culture, Sports, Science and Technology, Japan.
PY - 2008/2/25
Y1 - 2008/2/25
N2 - A feasibility study has been conducted to determine whether soldering process can be used for the joining of metallic glasses. The mechanical properties of metallic glasses are extremely attractive compared with conventional crystalline materials. In order to adopt bulk metallic glasses in a broader range of engineering applications, it is very important to establish appropriate joining processes of metallic glasses. During the joint of metallic glass, the most serious issue is the reformation of glassy phase at the high temperature area. Therefore, to avoid the recrystallization of glassy phase, the soldering process has been investigated to join metallic glasses. In this study, the spread test was mainly performed at 523 K for 60 s. Results showed that the Sn-3.0 mass%Ag-0.5 mass%Cu solder deposited on Pd-based metallic glass had better wetting characteristics than the Sn-57 mass%Bi and Sn-51 mass%In solders. The microstructure at the interface between Sn-3.0Ag-0.5Cu solder and Pd-based metallic glass was analyzed by scanning electron microscopy. It was clear that the intermetallic compound, PdSn4 phase, was formed at the interface.
AB - A feasibility study has been conducted to determine whether soldering process can be used for the joining of metallic glasses. The mechanical properties of metallic glasses are extremely attractive compared with conventional crystalline materials. In order to adopt bulk metallic glasses in a broader range of engineering applications, it is very important to establish appropriate joining processes of metallic glasses. During the joint of metallic glass, the most serious issue is the reformation of glassy phase at the high temperature area. Therefore, to avoid the recrystallization of glassy phase, the soldering process has been investigated to join metallic glasses. In this study, the spread test was mainly performed at 523 K for 60 s. Results showed that the Sn-3.0 mass%Ag-0.5 mass%Cu solder deposited on Pd-based metallic glass had better wetting characteristics than the Sn-57 mass%Bi and Sn-51 mass%In solders. The microstructure at the interface between Sn-3.0Ag-0.5Cu solder and Pd-based metallic glass was analyzed by scanning electron microscopy. It was clear that the intermetallic compound, PdSn4 phase, was formed at the interface.
KW - Interfacial reaction
KW - Lead-free solder
KW - Pd-based metallic glass
KW - Wetting characteristic
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U2 - 10.1016/j.mseb.2007.09.069
DO - 10.1016/j.mseb.2007.09.069
M3 - Article
AN - SCOPUS:38949180548
VL - 148
SP - 124
EP - 127
JO - Materials Science and Engineering B: Solid-State Materials for Advanced Technology
JF - Materials Science and Engineering B: Solid-State Materials for Advanced Technology
SN - 0921-5107
IS - 1-3
ER -