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W/Cu TSVs for 3D-LSI with minimum thermo-mechanical stress
Mariappan Murugesan, Hideto Hashiguchi, Harufumi Kobayashi, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
3
Citations
(Scopus)