Waferbond technologies and quality assessment

Maik Wiemer, Jörg Frömel, Thomas Geßner

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Increasingly, technologies are made available for the production of micro-systems, and for the assembly of their components on a wafer level. One basic condition for such wafer level integration is the existence of a suitable wafer bonding technique, either with or without the assistance of an intermediate layer. Depending on the individual case, several bonding techniques may be adopted to produce complex electronic or micro-mechanical component. The selection of the most suitable technique will be conditioned by the technologies used to produce the special devices. Together with the chosen bonding technique high bond strength and a leak tightness of the bonded compound must be realised. To characterize the bonds the micro chevron test for bond strength evaluation and resonant structures for sealing tests can be used.

Original languageEnglish
Title of host publicationSmart Systems Integration 2008 - 2nd European Conference and Exhibition on Integration Issues of Miniaturized Systems
Subtitle of host publicationMEMS, MOEMS, ICs and Electronic Components, SSI 2008
PublisherVDE
ISBN (Electronic)9783800730810
Publication statusPublished - 2008
Externally publishedYes
EventSmart Systems Integration 2008 - 2nd European Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, MOEMS, ICs and Electronic Components, SSI 2008 - Barcelona, Spain
Duration: 2008 Apr 92008 Apr 10

Publication series

NameSmart Systems Integration 2008 - 2nd European Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, MOEMS, ICs and Electronic Components, SSI 2008

Conference

ConferenceSmart Systems Integration 2008 - 2nd European Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, MOEMS, ICs and Electronic Components, SSI 2008
CountrySpain
CityBarcelona
Period08/4/908/4/10

Keywords

  • Assembly technology
  • Leak tightness
  • Micro-chevron test
  • SOI
  • Wafer bonding

ASJC Scopus subject areas

  • Computer Science Applications
  • Artificial Intelligence
  • Computer Networks and Communications

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