TY - GEN
T1 - Waferbond technologies and quality assessment
AU - Wiemer, Maik
AU - Frömel, Jörg
AU - Geßner, Thomas
N1 - Funding Information:
The authors would like thank to the following persons for cooperation: Dr. R. Knechtel (X-FAB), Dr. J. Bagdahn (FhG IWMH) and F. Sari (FhG ILT). The financial support of the German research project “MikroPrüf” (16SV1780) is greatly acknowledged.
Publisher Copyright:
© 2008 VDE. All rights reserved.
PY - 2008
Y1 - 2008
N2 - Increasingly, technologies are made available for the production of micro-systems, and for the assembly of their components on a wafer level. One basic condition for such wafer level integration is the existence of a suitable wafer bonding technique, either with or without the assistance of an intermediate layer. Depending on the individual case, several bonding techniques may be adopted to produce complex electronic or micro-mechanical component. The selection of the most suitable technique will be conditioned by the technologies used to produce the special devices. Together with the chosen bonding technique high bond strength and a leak tightness of the bonded compound must be realised. To characterize the bonds the micro chevron test for bond strength evaluation and resonant structures for sealing tests can be used.
AB - Increasingly, technologies are made available for the production of micro-systems, and for the assembly of their components on a wafer level. One basic condition for such wafer level integration is the existence of a suitable wafer bonding technique, either with or without the assistance of an intermediate layer. Depending on the individual case, several bonding techniques may be adopted to produce complex electronic or micro-mechanical component. The selection of the most suitable technique will be conditioned by the technologies used to produce the special devices. Together with the chosen bonding technique high bond strength and a leak tightness of the bonded compound must be realised. To characterize the bonds the micro chevron test for bond strength evaluation and resonant structures for sealing tests can be used.
KW - Assembly technology
KW - Leak tightness
KW - Micro-chevron test
KW - SOI
KW - Wafer bonding
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M3 - Conference contribution
AN - SCOPUS:85064665077
T3 - Smart Systems Integration 2008 - 2nd European Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, MOEMS, ICs and Electronic Components, SSI 2008
BT - Smart Systems Integration 2008 - 2nd European Conference and Exhibition on Integration Issues of Miniaturized Systems
PB - VDE
T2 - Smart Systems Integration 2008 - 2nd European Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, MOEMS, ICs and Electronic Components, SSI 2008
Y2 - 9 April 2008 through 10 April 2008
ER -