Wafer-to-wafer transportable gold particle plug for spot vacuum sealing of MEMS

Toshinori Ogashiwa, Kentaro Totsu, Mitsutomo Nishizawa, Hiroyuki Ishida, Kenichi Inoue, Yuya Sasaki, Masayuki Miyairi, Shuji Tanaka, Masayoshi Esashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

We have developed a spot vacuum sealing method utilizing conventional thermo-compression bonding at 160 °C with a transportable Au particle plug on a silicon through hole. The plug of which diameter is around 200 μm is composed of sub-micron-size Au particles and an Au thin film. The easy deformability of sintered Au particles leads to the hermeticity with changing the structure to closed pore state. The compliance with bond surface irregularity as well as the insensitivity to surface flatness are advantageous to hermetic sealing. From the deflection of Si diaphragms over the sealed cavity, the inside pressure was estimated below 100 Pa. The small leak rate of Kr-85 was below 4.7 × 10-12 Pa-m3/s detection limit, which was sufficient for the integration technology of MEMS.

Original languageEnglish
Title of host publicationTRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1304-1307
Number of pages4
ISBN (Electronic)9781538627310
DOIs
Publication statusPublished - 2017 Jul 26
Event19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017 - Kaohsiung, Taiwan, Province of China
Duration: 2017 Jun 182017 Jun 22

Publication series

NameTRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems

Other

Other19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017
CountryTaiwan, Province of China
CityKaohsiung
Period17/6/1817/6/22

Keywords

  • Au particle plug
  • Au particles
  • Thermo-compression bonding
  • Transfer substrate
  • Vacuum sealing
  • Wafer-level packaging

ASJC Scopus subject areas

  • Chemical Health and Safety
  • Instrumentation
  • Electrical and Electronic Engineering

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  • Cite this

    Ogashiwa, T., Totsu, K., Nishizawa, M., Ishida, H., Inoue, K., Sasaki, Y., Miyairi, M., Tanaka, S., & Esashi, M. (2017). Wafer-to-wafer transportable gold particle plug for spot vacuum sealing of MEMS. In TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems (pp. 1304-1307). [7994295] (TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/TRANSDUCERS.2017.7994295