Wafer-to-wafer transfer process of barium strontium titanate metal-insulator-metal structures by laser pre-irradiation and gold-gold bonding for frequency tuning applications

T. Samoto, H. Hirano, T. Somekawa, K. Hikichi, M. Fujita, M. Esashi, S. Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

This is the first report on successful direct transfer of barium strontium titanate (BST) grown on a sapphire substrate at high temperature (∼650 °C) to a target substrate at low temperature. The key point of the transfer process is the pre-irradiation of frequency-tripled Nd:YVO4 laser to a laser adsorption layer beneath the BST layer through the transparent substrate, which weakens BST/Pt adhesion by thermal effect. The bonded substrates separated at BST/Pt interface near sapphire by slight impact to sapphire. After forming an upper Pt electrode on the transferred BST, voltage tuning of the dielectric constant was confirmed.

Original languageEnglish
Title of host publication2013 Transducers and Eurosensors XXVII
Subtitle of host publicationThe 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013
Pages171-174
Number of pages4
DOIs
Publication statusPublished - 2013 Dec 1
Event2013 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013 - Barcelona, Spain
Duration: 2013 Jun 162013 Jun 20

Publication series

Name2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013

Other

Other2013 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013
CountrySpain
CityBarcelona
Period13/6/1613/6/20

Keywords

  • Barium strontium titanate
  • Laser assisted transfer process
  • Metal-insulator-metal variable capacitor
  • Wafer-to-wafer bonding

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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