Fingerprint Dive into the research topics of 'Wafer-to-wafer selective flip-chip transfer by sticky silicone bonding and laser debonding for rapid and easy integration test'. Together they form a unique fingerprint.
- Sort by
- Weight
- Alphabetically
Wafer-to-wafer selective flip-chip transfer by sticky silicone bonding and laser debonding for rapid and easy integration test
Shuji Tanaka, Masaki Yoshida, Hideki Hirano, Toshihiro Somekawa, Masayuki Fujita, Masayoshi Esashi
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
8
Citations
(Scopus)