Wafer-to-wafer selective flip-chip transfer by sticky silicone bonding and laser debonding for rapid and easy integration test

Shuji Tanaka, Masaki Yoshida, Hideki Hirano, Toshihiro Somekawa, Masayuki Fujita, Masayoshi Esashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

Wafer-bonding-based integration can be rapidly and easily tested between different types of devices by wafer-to-wafer flip-chip transfer technology described in this paper. Devices to be tested (e.g. MEMS) on a support wafer are bonded and electrically connected with a target wafer (e.g. LSI) using sticky silicone bumps, and then any of the devices are selectively debonded from the support wafer by backside laser irradiation. After transferred, the device is temporary sealed with a silicone ring, and underfill polymer can be used for permanent bonding. Because silicone bonding is made just by physical contact at room temperature, and the elasticity of silicone absorbs mismatch in thermal expansion, integration between different materials of wafer is possible. For practical demonstration, LiNbO3-based SAW resonators were transferred to an LSI wafer.

Original languageEnglish
Title of host publicationIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
Pages271-274
Number of pages4
DOIs
Publication statusPublished - 2013 Apr 2
EventIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013 - Taipei, Taiwan, Province of China
Duration: 2013 Jan 202013 Jan 24

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Other

OtherIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
CountryTaiwan, Province of China
CityTaipei
Period13/1/2013/1/24

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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