Wafer thinning for high-density three dimensional integration - 12-inch wafer-level 3D-LSI program at GINTI

M. Murugesan, T. Fukushima, J. C. Bea, H. Hashimoto, Y. Sato, K. W. Lee, M. Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

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Chemical Compounds

Engineering & Materials Science