Wafer thinning for high-density three dimensional integration - 12-inch wafer-level 3D-LSI program at GINTI

M. Murugesan, T. Fukushima, J. C. Bea, H. Hashimoto, Y. Sato, K. W. Lee, M. Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Thinning down large scale integrated-chip (LSI) wafers to below 50 μm thickness is inevitable for the wafer-to-wafer (WtW) process as well as chip-to-wafer (CtW) or chip-to-chip (CtC) processes in three-dimensional LSI integration. In this work we have optimized edge-trimming and back-grinding followed by chemical-mechanical polishing processes for WtW integration of 12-inch LSI wafer with thickness ≤ 50 μm. After optimization, we were able to achieve the total thickness variation (TTV) of less than 200 nm in the 50 μm-thick LSI wafers. Also, it was found that the smaller TTV value of temporarily bonded wafer before wafer thinning greatly helps to reduce the TTV in the back-ground and polished wafers. We successfully integrated 50 μm-thick 8- and 12-inch LSI wafers to their respective passive interposers using Cu-TSVs, and the electrical properties of TSVs were evaluated.

Original languageEnglish
Title of host publication25th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages57-61
Number of pages5
ISBN (Print)9781479939442
DOIs
Publication statusPublished - 2014 Jan 1
Event25th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2014 - Saratoga Springs, NY, United States
Duration: 2014 May 192014 May 21

Publication series

NameASMC (Advanced Semiconductor Manufacturing Conference) Proceedings
ISSN (Print)1078-8743

Other

Other25th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2014
CountryUnited States
CitySaratoga Springs, NY
Period14/5/1914/5/21

Keywords

  • 3D-Integration
  • Cu-TSV
  • Wafer thinning

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Engineering(all)
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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