Wafer-level vacuum packaging for hetero-integration by thermo-compression bonding using planarized-electroplated gold bumps

Muhammad Salman Al Farisi, Hideki Hirano, Shuji Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Wafer-level vacuum sealing and electrical interconnection are often crucial for advanced device packaging. This article presents a novel packaging and integration technology, which is applicable to non-planar (i.e. microstructured) and/or temperature-sensitive wafers, by means of Au-Au low-temperature thermo-compression bonding utilizing electroplated Au microbump that surface has been planarized by single-point diamond fly-cut. Device integration, vacuum encapsulation, and electrical interconnection at the same time is the major advantage offered by the proposed technology. In this study, the sealing pressure was evaluated under various bonding conditions by the zero-balance method utilizing diaphragm-structured devices for bonding test. The vacuum sealing pressure was obtained as a few kPa, or even better without introducing any getter materials. The bonding shear strength was also measured to be higher than 100 MPa.

Original languageEnglish
Title of host publication2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages573-577
Number of pages5
ISBN (Electronic)9781509019472
DOIs
Publication statusPublished - 2016 Nov 28
Event11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016 - Sendai, Japan
Duration: 2016 Apr 172016 Apr 20

Publication series

Name2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016

Other

Other11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016
CountryJapan
CitySendai
Period16/4/1716/4/20

Keywords

  • Au-Au thermo-compression bonding
  • Hetero-integration
  • single-point diamond fly-cutting
  • wafer-level hermetic sealing
  • zero-balance method

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Mechanical Engineering
  • Mechanics of Materials
  • Electronic, Optical and Magnetic Materials

Fingerprint Dive into the research topics of 'Wafer-level vacuum packaging for hetero-integration by thermo-compression bonding using planarized-electroplated gold bumps'. Together they form a unique fingerprint.

  • Cite this

    Al Farisi, M. S., Hirano, H., & Tanaka, S. (2016). Wafer-level vacuum packaging for hetero-integration by thermo-compression bonding using planarized-electroplated gold bumps. In 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016 (pp. 573-577). [7758317] (2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/NEMS.2016.7758317