Wafer level packaging of MEMS

Masayoshi Esashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

Wafer level packaging methods of MEMS are described. These play important roles to reduce cost and to improve reliability. MEMS structures on silicon chips are encapsulated with bonded caps or with shells fabricated by surface micromachining, and electrical interconnections are made from the cavity. Vacuum packaging methods are also described.

Original languageEnglish
Title of host publicationTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
Pages9-16
Number of pages8
DOIs
Publication statusPublished - 2009 Dec 11
EventTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems - Denver, CO, United States
Duration: 2009 Jun 212009 Jun 25

Publication series

NameTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems

Other

OtherTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
CountryUnited States
CityDenver, CO
Period09/6/2109/6/25

Keywords

  • Bonding
  • MEMS
  • Wafer level packaging

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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