Wafer-level high vacuum packaging using titanium thin film as bonding and gettering material

Toshihiko Takahata, Hideki Hirano, Joerg Froemel, Shuji Tanak, Yuji Takakuwa

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

Resonant MEMS sensors such as vibratory gyroscope require wafer-level high vacuum packaging to reduce air damping for enhancing a quality factor. Gettering materials such as titanium which adsorb residual gases in the sealed cavity are generally encapsulated inside a package to achieve higher vacuum. In this paper, we propose titanium thin-film for bonding frame as well as gettering material. Wafer-level high vacuum packaging was achieved by the Ti-Ti bonding when thickness of native oxide on Ti surface is well controlled.

Original languageEnglish
Pages (from-to)387-391
Number of pages5
JournalIEEJ Transactions on Sensors and Micromachines
Volume138
Issue number8
DOIs
Publication statusPublished - 2018 Jan 1

Keywords

  • Gettering
  • High vacuum sealing
  • TEM
  • Titanium
  • UPS
  • Wafer level packaging
  • XPS

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering

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