Wafer-level hermetic packaging technology for MEMS using anodically-bondable LTCC wafer

Shuji Tanaka, Sakae Matsuzaki, Mamoru Mohri, Atsushi Okada, Hideyuki Fukushi, Masayoshi Esashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

25 Citations (Scopus)

Fingerprint Dive into the research topics of 'Wafer-level hermetic packaging technology for MEMS using anodically-bondable LTCC wafer'. Together they form a unique fingerprint.

Chemical Compounds

Physics & Astronomy

Engineering & Materials Science