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Wafer-level hermetic packaging technology for MEMS using anodically-bondable LTCC wafer
Shuji Tanaka, Sakae Matsuzaki, Mamoru Mohri, Atsushi Okada, Hideyuki Fukushi, Masayoshi Esashi
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
25
Citations
(Scopus)