Wafer-level hermetic packaging technology for MEMS using anodically-bondable LTCC wafer

Shuji Tanaka; Sakae Matsuzaki; Mamoru Mohri; Atsushi Okada; Hideyuki Fukushi; Masayoshi Esashi

doi:10.1109/MEMSYS.2011.5734440

Wafer-level hermetic packaging technology for MEMS using anodically-bondable LTCC wafer

Shuji Tanaka, Sakae Matsuzaki, Mamoru Mohri, Atsushi Okada, Hideyuki Fukushi, Masayoshi Esashi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

27 Citations (Scopus)

Abstract

This paper describes a versatile and reliable wafer-level hermetic packaging technology using an anodically-bondable low temperature cofired ceramic (LTCC) wafer, in which electrical feedthroughs and passive components can be embedded. The hermeticity of vacuum-sealed cavities was confirmed after 3000 cycles of heat shock (-40 °C/+150 °C, 30 min/30 min) by diaphragm method. The width of seal rings necessary for hermetic sealing of saw-diced chips is 0.1 mm or less. Electrical connection between MEMS on a Si wafer and feedthroughs in the LTCC wafer was established using Sn-containing met al stack simultaneously with anodic bonding. The developed wafer-level hermetic packaging technology is ready for practical applications.

Original language	English
Title of host publication	2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011
Pages	376-379
Number of pages	4
DOIs	https://doi.org/10.1109/MEMSYS.2011.5734440
Publication status	Published - 2011 Apr 13
Event	24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011 - Cancun, Mexico Duration: 2011 Jan 23 → 2011 Jan 27

Publication series

Name	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)	1084-6999

Other

Other	24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011
Country/Territory	Mexico
City	Cancun
Period	11/1/23 → 11/1/27

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Mechanical Engineering
Electrical and Electronic Engineering

Access to Document

10.1109/MEMSYS.2011.5734440

Cite this

Tanaka, S., Matsuzaki, S., Mohri, M., Okada, A., Fukushi, H., & Esashi, M. (2011). Wafer-level hermetic packaging technology for MEMS using anodically-bondable LTCC wafer. In 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011 (pp. 376-379). [5734440] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2011.5734440

Wafer-level hermetic packaging technology for MEMS using anodically-bondable LTCC wafer. / Tanaka, Shuji; Matsuzaki, Sakae; Mohri, Mamoru; Okada, Atsushi; Fukushi, Hideyuki; Esashi, Masayoshi.

2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011. 2011. p. 376-379 5734440 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Tanaka, S, Matsuzaki, S, Mohri, M, Okada, A, Fukushi, H & Esashi, M 2011, Wafer-level hermetic packaging technology for MEMS using anodically-bondable LTCC wafer. in 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011., 5734440, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), pp. 376-379, 24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011, Cancun, Mexico, 11/1/23. https://doi.org/10.1109/MEMSYS.2011.5734440

Tanaka S, Matsuzaki S, Mohri M, Okada A, Fukushi H, Esashi M. Wafer-level hermetic packaging technology for MEMS using anodically-bondable LTCC wafer. In 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011. 2011. p. 376-379. 5734440. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2011.5734440

Tanaka, Shuji ; Matsuzaki, Sakae ; Mohri, Mamoru ; Okada, Atsushi ; Fukushi, Hideyuki ; Esashi, Masayoshi. / Wafer-level hermetic packaging technology for MEMS using anodically-bondable LTCC wafer. 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011. 2011. pp. 376-379 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

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Wafer-level hermetic packaging technology for MEMS using anodically-bondable LTCC wafer

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