Wafer-level hermetic MEMS packaging by anodic bonding and its reliability issues

Shuji Tanaka

doi:10.1016/j.microrel.2014.02.001

Wafer-level hermetic MEMS packaging by anodic bonding and its reliability issues

Shuji Tanaka

Research output: Contribution to journal › Article › peer-review

53 Citations (Scopus)

Abstract

This paper reviews wafer-level hermetic packaging technology using anodic bonding from several reliability points of view. First, reliability risk factors of high temperature, high voltage and electrochemical O₂ generation during anodic bonding are discussed. Next, electrical interconnections through a hermetic package, i.e. electrical feedthrough, is discussed. The reliability of both hermetic sealing and electrical feedthrough must be simultaneously satisfied. In the last part of this paper, a new wafer-level MEMS packaging material, anodically-bondable low temperature cofired ceramic (LTCC) wafer, is introduced, and its reliability data on hermetic sealing, electrical interconnection and flip-chip mounting on a printed circuit board (PCB) are described.

Original language	English
Pages (from-to)	875-881
Number of pages	7
Journal	Microelectronics Reliability
Volume	54
Issue number	5
DOIs	https://doi.org/10.1016/j.microrel.2014.02.001
Publication status	Published - 2014 May
Externally published	Yes

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Condensed Matter Physics
Safety, Risk, Reliability and Quality
Surfaces, Coatings and Films
Electrical and Electronic Engineering

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10.1016/j.microrel.2014.02.001

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title = "Wafer-level hermetic MEMS packaging by anodic bonding and its reliability issues",

abstract = "This paper reviews wafer-level hermetic packaging technology using anodic bonding from several reliability points of view. First, reliability risk factors of high temperature, high voltage and electrochemical O2 generation during anodic bonding are discussed. Next, electrical interconnections through a hermetic package, i.e. electrical feedthrough, is discussed. The reliability of both hermetic sealing and electrical feedthrough must be simultaneously satisfied. In the last part of this paper, a new wafer-level MEMS packaging material, anodically-bondable low temperature cofired ceramic (LTCC) wafer, is introduced, and its reliability data on hermetic sealing, electrical interconnection and flip-chip mounting on a printed circuit board (PCB) are described.",

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AB - This paper reviews wafer-level hermetic packaging technology using anodic bonding from several reliability points of view. First, reliability risk factors of high temperature, high voltage and electrochemical O2 generation during anodic bonding are discussed. Next, electrical interconnections through a hermetic package, i.e. electrical feedthrough, is discussed. The reliability of both hermetic sealing and electrical feedthrough must be simultaneously satisfied. In the last part of this paper, a new wafer-level MEMS packaging material, anodically-bondable low temperature cofired ceramic (LTCC) wafer, is introduced, and its reliability data on hermetic sealing, electrical interconnection and flip-chip mounting on a printed circuit board (PCB) are described.

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Wafer-level hermetic MEMS packaging by anodic bonding and its reliability issues

Abstract

ASJC Scopus subject areas

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