Wafer-level fabricated micro beam splitter based on 45-degree saw dicing of glass substrate

S. Bargiel, M. Baranski, N. Passilly, B. Guichardaz, E. Herth, C. Gorecki, C. Jia, J. Fromel, M. Wiemer

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This work presents the development of an integrated micro-optical beam splitter that can be arranged in array, and based on saw-dicing of glass substrates. The latter allows a rapid and rather low-cost processing, and in addition leads to high compactness and possibility of wafer level alignments, suitable for vertically integrated imaging microinstruments. The device allowing additional out-of plane reflection for extraction of sensing beam can be as small as 1mm3.

Original languageEnglish
Title of host publication2013 Transducers and Eurosensors XXVII
Subtitle of host publicationThe 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013
Pages534-537
Number of pages4
DOIs
Publication statusPublished - 2013 Dec 1
Externally publishedYes
Event2013 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013 - Barcelona, Spain
Duration: 2013 Jun 162013 Jun 20

Publication series

Name2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013

Other

Other2013 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013
CountrySpain
CityBarcelona
Period13/6/1613/6/20

Keywords

  • MOEMS
  • Optical instrumentation
  • UV bonding
  • beam splitter
  • dielectric mirror
  • glass micromachining
  • saw dicing
  • vertical integration

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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