Wafer level encapsulation of microsystems using glass frit bonding

R. Knechtel, M. Wiemer, J. Frömel

Research output: Contribution to journalArticlepeer-review

64 Citations (Scopus)


This paper gives an introduction to glass frit wafer bonding, which is an universally useable technology for encapsulation of microsystems, especially surface micromechanical sensors on wafer level. After a process description, some mechanical as well as electrical characteristics of glass frit bonded wafers are discussed and applications are shown.

Original languageEnglish
Pages (from-to)468-472
Number of pages5
JournalMicrosystem Technologies
Issue number5
Publication statusPublished - 2006 Apr
Externally publishedYes


  • Encapsulation
  • Glass frit
  • Interface and material characterization
  • MEMS
  • Wafer bonding

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Hardware and Architecture
  • Electrical and Electronic Engineering


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