Wafer bonding of polycrystalline spinel with LiNbO3/LiTaO 3 for temperature compensation of RF surface acoustic wave devices

Keiichiro Geshi, Kanji Teraoka, Yutaka Tsuji, Akihito Fujii, Yoshihiro Imagawa, Shigeru Nakayama, Ken Ya Hashimoto, Shuji Tanaka, Kentaro Totsu, Hideki Takagi

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Engineering & Materials Science