Wafer bonding of polycrystalline spinel with LiNbO3/LiTaO 3 for temperature compensation of RF surface acoustic wave devices

Keiichiro Geshi, Kanji Teraoka, Yutaka Tsuji, Akihito Fujii, Yoshihiro Imagawa, Shigeru Nakayama, Ken Ya Hashimoto, Shuji Tanaka, Kentaro Totsu, Hideki Takagi

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

This paper proposes use of polycrystalline spinel for the temperature compensation of radio frequency (RF) surface acoustic wave (SAW) devices. Spinel can be bonded with LiTaO3 (LT) and LiNbO3 (LN) wafers by using adhesive and direct bonding techniques. A series of RF SAW resonators were fabricated on the LT(LN)/spinel structure, and their performance, including the temperature coefficient of frequency (TCF), was measured. For comparison, SAW resonators employing Si and sapphire in place of spinel were also fabricated. The result indicated that the polycrystalline spinel offers TCF improvement better than other materials.

Original languageEnglish
Pages (from-to)116-119
Number of pages4
JournalSEI Technical Review
Issue number75
Publication statusPublished - 2012 Oct 1

Keywords

  • SAW resonator
  • Spinel
  • Temperature coefficient of frequency
  • Temperature compensation
  • Wafer bonding

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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