Wafer bonding of polycrystalline spinel with LiNbO3/LiTaO 3 for temperature compensation of RF surface acoustic wave devices

K. Geshi, K. Teraoka, S. Kinoshita, M. Nakayama, Y. Imagawa, S. Nakayama, K. Hashimoto, S. Tanaka, K. Totsu, H. Takagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

This paper proposes use of polycrystalline spinel for the temperature compensation of RF surface acoustic wave (SAW) devices. Spinel can be bonded with LiTaO3 (LT) and LiNbO3 (LN) wafers by using adhesive and direct bonding techniques. A series of RF SAW resonators were fabricated on the LT(LN)/spinel structure, and their performance including the temperature coefficient of frequency (TCF) was measured. For comparison, SAW resonators employing Si, sapphire and alumina in place of spinel were also fabricated. The result indicated that the polycrystalline spinel offers TCF improvement better than the other materials.

Original languageEnglish
Title of host publication2012 IEEE International Ultrasonics Symposium, IUS 2012
Pages2726-2729
Number of pages4
DOIs
Publication statusPublished - 2012 Dec 1
Event2012 IEEE International Ultrasonics Symposium, IUS 2012 - Dresden, Germany
Duration: 2012 Oct 72012 Oct 10

Publication series

NameIEEE International Ultrasonics Symposium, IUS
ISSN (Print)1948-5719
ISSN (Electronic)1948-5727

Other

Other2012 IEEE International Ultrasonics Symposium, IUS 2012
Country/TerritoryGermany
CityDresden
Period12/10/712/10/10

Keywords

  • SAW resonator
  • spinel
  • temperature coefficient of frequency
  • temperature compensation
  • wafer bonding

ASJC Scopus subject areas

  • Acoustics and Ultrasonics

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