TY - GEN
T1 - Wafer bonding of polycrystalline spinel with LiNbO3/LiTaO 3 for temperature compensation of RF surface acoustic wave devices
AU - Geshi, K.
AU - Teraoka, K.
AU - Kinoshita, S.
AU - Nakayama, M.
AU - Imagawa, Y.
AU - Nakayama, S.
AU - Hashimoto, K.
AU - Tanaka, S.
AU - Totsu, K.
AU - Takagi, H.
PY - 2012/12/1
Y1 - 2012/12/1
N2 - This paper proposes use of polycrystalline spinel for the temperature compensation of RF surface acoustic wave (SAW) devices. Spinel can be bonded with LiTaO3 (LT) and LiNbO3 (LN) wafers by using adhesive and direct bonding techniques. A series of RF SAW resonators were fabricated on the LT(LN)/spinel structure, and their performance including the temperature coefficient of frequency (TCF) was measured. For comparison, SAW resonators employing Si, sapphire and alumina in place of spinel were also fabricated. The result indicated that the polycrystalline spinel offers TCF improvement better than the other materials.
AB - This paper proposes use of polycrystalline spinel for the temperature compensation of RF surface acoustic wave (SAW) devices. Spinel can be bonded with LiTaO3 (LT) and LiNbO3 (LN) wafers by using adhesive and direct bonding techniques. A series of RF SAW resonators were fabricated on the LT(LN)/spinel structure, and their performance including the temperature coefficient of frequency (TCF) was measured. For comparison, SAW resonators employing Si, sapphire and alumina in place of spinel were also fabricated. The result indicated that the polycrystalline spinel offers TCF improvement better than the other materials.
KW - SAW resonator
KW - spinel
KW - temperature coefficient of frequency
KW - temperature compensation
KW - wafer bonding
UR - http://www.scopus.com/inward/record.url?scp=84882321702&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84882321702&partnerID=8YFLogxK
U2 - 10.1109/ULTSYM.2012.0683
DO - 10.1109/ULTSYM.2012.0683
M3 - Conference contribution
AN - SCOPUS:84882321702
SN - 9781467345613
T3 - IEEE International Ultrasonics Symposium, IUS
SP - 2726
EP - 2729
BT - 2012 IEEE International Ultrasonics Symposium, IUS 2012
T2 - 2012 IEEE International Ultrasonics Symposium, IUS 2012
Y2 - 7 October 2012 through 10 October 2012
ER -