Vertical integration of array-type miniature interferometers at wafer level by using multistack anodic bonding

Wei Shan Wang, Maik Wiemer, Joerg Froemel, Tom Enderlein, Thomas Gessner, Justine Lullin, Sylwester Bargiel, Nicolas Passilly, Jorge Albero, Christophe Gorecki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Vertical integration of array-type miniature interferometers at wafer level by using multistack anodic bonding'. Together they form a unique fingerprint.

Mathematics

Physics & Astronomy

Engineering & Materials Science

Chemical Compounds