Vertical-cavity surface-emitting laser chip bonding by surface-tension-driven self-assembly for optoelectronic heterogeneous integration

Yuka Ito, Takafumi Fukushima, Hisashi Kino, Kang Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Contribution to journalArticlepeer-review

8 Citations (Scopus)

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Engineering & Materials Science

Physics & Astronomy