TY - JOUR
T1 - Vertical-cavity surface-emitting laser chip bonding by surface-tension-driven self-assembly for optoelectronic heterogeneous integration
AU - Ito, Yuka
AU - Fukushima, Takafumi
AU - Kino, Hisashi
AU - Lee, Kang Wook
AU - Choki, Koji
AU - Tanaka, Tetsu
AU - Koyanagi, Mitsumasa
N1 - Publisher Copyright:
© 2015 The Japan Society of Applied Physics.
PY - 2015/3/1
Y1 - 2015/3/1
N2 - Twelve-channel vertical-cavity surface-emitting laser (12-ch VCSEL) chips are heterogeneously self-assembled on Si and glass wafers using water surface tension as a driving force. The VCSEL chips have a high length-to-width aspect ratio, that is, 3 mm long and 0.35 mm wide. The VCSEL chips are precisely self-assembled with alignment accuracies within 2 μm even when they are manually placed on liquid droplets provided on the host substrate. After the self-assembly of the VCSEL chips and the subsequent thermal compression, the chips successfully emit 850 nm light and exhibit no degradation of their current-voltage (I-V) characteristics.
AB - Twelve-channel vertical-cavity surface-emitting laser (12-ch VCSEL) chips are heterogeneously self-assembled on Si and glass wafers using water surface tension as a driving force. The VCSEL chips have a high length-to-width aspect ratio, that is, 3 mm long and 0.35 mm wide. The VCSEL chips are precisely self-assembled with alignment accuracies within 2 μm even when they are manually placed on liquid droplets provided on the host substrate. After the self-assembly of the VCSEL chips and the subsequent thermal compression, the chips successfully emit 850 nm light and exhibit no degradation of their current-voltage (I-V) characteristics.
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U2 - 10.7567/JJAP.54.030206
DO - 10.7567/JJAP.54.030206
M3 - Article
AN - SCOPUS:84924269270
VL - 54
JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
SN - 0021-4922
IS - 3
M1 - 030206
ER -