Vertical-cavity surface-emitting laser chip bonding by surface-tension-driven self-assembly for optoelectronic heterogeneous integration

Yuka Ito, Takafumi Fukushima, Hisashi Kino, Kanuku Ri, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

Twelve-channel vertical-cavity surface-emitting laser (12-ch VCSEL) chips are heterogeneously self-assembled on Si and glass wafers using water surface tension as a driving force. The VCSEL chips have a high length-to-width aspect ratio, that is, 3 mm long and 0.35 mm wide. The VCSEL chips are precisely self-assembled with alignment accuracies within 2 μm even when they are manually placed on liquid droplets provided on the host substrate. After the self-assembly of the VCSEL chips and the subsequent thermal compression, the chips successfully emit 850 nm light and exhibit no degradation of their current-voltage (I-V) characteristics.

Original languageEnglish
Article number030206
JournalJapanese journal of applied physics
Volume54
Issue number3
DOIs
Publication statusPublished - 2015 Mar 1

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

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