Vertical-cavity surface-emitting laser chip bonding by surface-tension-driven self-assembly for optoelectronic heterogeneous integration

Yuka Ito; Takafumi Fukushima; Hisashi Kino; Kanuku Ri; Koji Choki; Tetsu Tanaka; Mitsumasa Koyanagi

doi:10.7567/JJAP.54.030206

Vertical-cavity surface-emitting laser chip bonding by surface-tension-driven self-assembly for optoelectronic heterogeneous integration

Yuka Ito, Takafumi Fukushima, Hisashi Kino, Kanuku Ri, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Contribution to journal › Article

7 Citations (Scopus)

Abstract

Twelve-channel vertical-cavity surface-emitting laser (12-ch VCSEL) chips are heterogeneously self-assembled on Si and glass wafers using water surface tension as a driving force. The VCSEL chips have a high length-to-width aspect ratio, that is, 3 mm long and 0.35 mm wide. The VCSEL chips are precisely self-assembled with alignment accuracies within 2 μm even when they are manually placed on liquid droplets provided on the host substrate. After the self-assembly of the VCSEL chips and the subsequent thermal compression, the chips successfully emit 850 nm light and exhibit no degradation of their current-voltage (I-V) characteristics.

Original language	English
Article number	030206
Journal	Japanese journal of applied physics
Volume	54
Issue number	3
DOIs	https://doi.org/10.7567/JJAP.54.030206
Publication status	Published - 2015 Mar 1

ASJC Scopus subject areas

Engineering(all)
Physics and Astronomy(all)

Access to Document

10.7567/JJAP.54.030206

Fingerprint Dive into the research topics of 'Vertical-cavity surface-emitting laser chip bonding by surface-tension-driven self-assembly for optoelectronic heterogeneous integration'. Together they form a unique fingerprint.

Cite this

Ito, Y., Fukushima, T., Kino, H., Ri, K., Choki, K., Tanaka, T., & Koyanagi, M. (2015). Vertical-cavity surface-emitting laser chip bonding by surface-tension-driven self-assembly for optoelectronic heterogeneous integration. Japanese journal of applied physics, 54(3), [030206]. https://doi.org/10.7567/JJAP.54.030206

Vertical-cavity surface-emitting laser chip bonding by surface-tension-driven self-assembly for optoelectronic heterogeneous integration. / Ito, Yuka; Fukushima, Takafumi ; Kino, Hisashi; Ri, Kanuku; Choki, Koji; Tanaka, Tetsu; Koyanagi, Mitsumasa.

In: Japanese journal of applied physics, Vol. 54, No. 3, 030206, 01.03.2015.

Research output: Contribution to journal › Article

@article{539918193c1d40ff8e75848f79602487,

title = "Vertical-cavity surface-emitting laser chip bonding by surface-tension-driven self-assembly for optoelectronic heterogeneous integration",

abstract = "Twelve-channel vertical-cavity surface-emitting laser (12-ch VCSEL) chips are heterogeneously self-assembled on Si and glass wafers using water surface tension as a driving force. The VCSEL chips have a high length-to-width aspect ratio, that is, 3 mm long and 0.35 mm wide. The VCSEL chips are precisely self-assembled with alignment accuracies within 2 μm even when they are manually placed on liquid droplets provided on the host substrate. After the self-assembly of the VCSEL chips and the subsequent thermal compression, the chips successfully emit 850 nm light and exhibit no degradation of their current-voltage (I-V) characteristics.",

author = "Yuka Ito and Takafumi Fukushima and Hisashi Kino and Kanuku Ri and Koji Choki and Tetsu Tanaka and Mitsumasa Koyanagi",

year = "2015",

month = mar,

day = "1",

doi = "10.7567/JJAP.54.030206",

language = "English",

volume = "54",

journal = "Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes",

issn = "0021-4922",

publisher = "Japan Society of Applied Physics",

number = "3",

}

TY - JOUR

T1 - Vertical-cavity surface-emitting laser chip bonding by surface-tension-driven self-assembly for optoelectronic heterogeneous integration

AU - Ito, Yuka

AU - Fukushima, Takafumi

AU - Kino, Hisashi

AU - Ri, Kanuku

AU - Choki, Koji

AU - Tanaka, Tetsu

AU - Koyanagi, Mitsumasa

PY - 2015/3/1

Y1 - 2015/3/1

N2 - Twelve-channel vertical-cavity surface-emitting laser (12-ch VCSEL) chips are heterogeneously self-assembled on Si and glass wafers using water surface tension as a driving force. The VCSEL chips have a high length-to-width aspect ratio, that is, 3 mm long and 0.35 mm wide. The VCSEL chips are precisely self-assembled with alignment accuracies within 2 μm even when they are manually placed on liquid droplets provided on the host substrate. After the self-assembly of the VCSEL chips and the subsequent thermal compression, the chips successfully emit 850 nm light and exhibit no degradation of their current-voltage (I-V) characteristics.

AB - Twelve-channel vertical-cavity surface-emitting laser (12-ch VCSEL) chips are heterogeneously self-assembled on Si and glass wafers using water surface tension as a driving force. The VCSEL chips have a high length-to-width aspect ratio, that is, 3 mm long and 0.35 mm wide. The VCSEL chips are precisely self-assembled with alignment accuracies within 2 μm even when they are manually placed on liquid droplets provided on the host substrate. After the self-assembly of the VCSEL chips and the subsequent thermal compression, the chips successfully emit 850 nm light and exhibit no degradation of their current-voltage (I-V) characteristics.

UR - http://www.scopus.com/inward/record.url?scp=84924269270&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84924269270&partnerID=8YFLogxK

U2 - 10.7567/JJAP.54.030206

DO - 10.7567/JJAP.54.030206

M3 - Article

AN - SCOPUS:84924269270

VL - 54

JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

SN - 0021-4922

IS - 3

M1 - 030206

ER -