Abstract
A two-dimensional (2D) optical-parallel interconnection module was developed using vertical-cavity surface-emitting lasers (VCSELs) which have a low threshold, high temperature tolerance and uniform and effective fiber coupling characteristics. The 8×2 - arrayed VCSEL was self-aligned to a developed plastic-molded receptacle-type package using flip-chip solder bonding technique and a developed ball-guide die bonding technique. The module exhibited high data throughput of 1 Gb/s at temperatures up to 70°C, high optical coupling efficiency of 85.8±2.93% and high mechanical durability of less than 0.26 dB for 100 times of manual push/pull matings with a developed multifiber push-on (MPO) - type 2D fiber connector. As an application of the high-density, high-throughput an optical parallel interconnections, optical full crossbar switch with a simple architecture and fabricated plastic-molded optical crossbar connectors was demonstrated.
| Original language | English |
|---|---|
| Pages (from-to) | 1394-1399 |
| Number of pages | 6 |
| Journal | Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers |
| Volume | 37 |
| Issue number | 3 SUPPL. B |
| DOIs | |
| Publication status | Published - 1998 Mar |
Keywords
- Optical fiber coupling
- Optical interconnections
- Parallel processing
- Plastic packaging
- Semiconductor device packaging
- Semiconductor laser arrays
- Surface mounting
- Surface-emitting lasers
ASJC Scopus subject areas
- Engineering(all)
- Physics and Astronomy(all)