Versatile wafer-level hermetic packaging technology using anodically-bondable LTCC wafer with compliant porous gold bumps spontaneously formed in wet-etched cavities

Shuji Tanaka, Mamoru Mohri, Atsushi Okada, Hideyuki Fukushi, Masayoshi Esashi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

12 Citations (Scopus)

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Engineering

Material Science