Verification of the governing parameter for electromigration damage in passivated polycrystalline line

Kazuhiko Sasagawa, Masataka Hasegawa, Masumi Saka, Hiroyuki Abé

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Due to electromigration, mechanical stress (atomic density) gradient appears in the passivated lines, and plays an important part in electromigration mechanism. Recently, a governing parameter, AFD* gen, for electromigration damage in the passivated polycrystalline lines was formulated. The formulation was carried out by adding the effect of atomic density gradient to the governing parameter, AFDgen, for electromigration damage in unpassivated polycrystalline and bamboo lines, which has been proposed and utilized to construct a method for failure prediction in these lines. In this paper, the passivated polycrystalline lines with two different lengths are treated. Both are straight shaped lines, which are made of the same Al film. But, they are different in line length. The characteristics in each line are obtained using the AFD* gen-based method for determination of film characteristics. The usefulness of AFD*gen is verified through the comparison of the film characteristics obtained for these two kinds of lines.

Original languageEnglish
Title of host publicationAdvances in Electronic Packaging; Manufacturing, Microelectronics Systems Systems and Exploratory Topics, Optoelectronics and Photonic Packaging
Pages1531-1539
Number of pages9
Publication statusPublished - 2001 Dec 1
EventAdvances in Electronic Packaging - Kauai, Hi, United States
Duration: 2001 Jul 82001 Jul 13

Publication series

NameAdvances in Electronic Packaging
Volume3

Other

OtherAdvances in Electronic Packaging
CountryUnited States
CityKauai, Hi
Period01/7/801/7/13

ASJC Scopus subject areas

  • Engineering(all)
  • Electrical and Electronic Engineering

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  • Cite this

    Sasagawa, K., Hasegawa, M., Saka, M., & Abé, H. (2001). Verification of the governing parameter for electromigration damage in passivated polycrystalline line. In Advances in Electronic Packaging; Manufacturing, Microelectronics Systems Systems and Exploratory Topics, Optoelectronics and Photonic Packaging (pp. 1531-1539). (Advances in Electronic Packaging; Vol. 3).