Varifocal Scanner Using Wafer Bonding

Kenta Nakazawa, Takashi Sasaki, Hiromasa Furuta, Jiro Kamiya, Toshikazu Kamiya, Kazuhiro Hane

Research output: Contribution to journalArticlepeer-review

7 Citations (Scopus)

Abstract

We present a varifocal mirror integrated with a comb-drive scanner (varifocal scanner) fabricated by using a wafer bonding technology. An Au-Au thermocompression bonding technology is utilized for the integration. The bonding technology enables fabricating the multiple single crystalline Si layers on a wafer. The varifocal scanner consists of the three Si layers: 1) the fixed comb layer; 2) the scanner frame layer; and 3) the varifocal mirror layer. The 2-mm-diameter and 10-μm-thick varifocal mirror is fabricated on the 60 μm thick comb-drive scanner. The focal length modulation range of the varifocal mirror is from-523 to 139 mm at the frequency of 18.3 kHz. The optical angle is 7° at the resonant frequency of 3.59 kHz. The motion couplings between the varifocal mirror and the scanner are also investigated.

Original languageEnglish
Article number7857674
Pages (from-to)440-447
Number of pages8
JournalJournal of Microelectromechanical Systems
Volume26
Issue number2
DOIs
Publication statusPublished - 2017 Apr

Keywords

  • Varifocal mirror
  • micro-optoelectromechanical systems (MOEMS)
  • scanner
  • wafer bonding

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering

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