Varifocal mirror integrated with scanner using wafer bonding technology

Kenta Nakazawa, Takashi Sasaki, Hiromasa Furuta, Jiro Kamiya, Hideki Sasaki, Toshikazu Kamiya, Kazuhiro Hane

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The integration of a varifocal mirror with a scanner using wafer bonding technology is presented. The wafer bonding technology enables us to enlarge the design possibility. A 2 mm diameter varifocal mirror is bonded on the scanner. The optical scanning angle is 7° at 3.59 kHz. The focal length changes from infinity to 139 mm.

Original languageEnglish
Title of host publication2016 International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Proceedings
PublisherIEEE Computer Society
ISBN (Electronic)9781509010356
DOIs
Publication statusPublished - 2016 Sep 13
Event21st International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Singapore, Singapore
Duration: 2016 Jul 312016 Aug 4

Publication series

NameInternational Conference on Optical MEMS and Nanophotonics
Volume2016-September
ISSN (Print)2160-5033
ISSN (Electronic)2160-5041

Other

Other21st International Conference on Optical MEMS and Nanophotonics, OMN 2016
CountrySingapore
CitySingapore
Period16/7/3116/8/4

Keywords

  • Micro-mirror
  • Scanner
  • Varifocal mirror
  • Wafer bonding

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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