Vacuum-sealed silicon micromachined pressure sensors

Masayoshi Esashi, Susumu Sugiyama, Kyoichi Ikeda, Yuelin Wang, Haruzo Miyashita

Research output: Contribution to journalArticlepeer-review

96 Citations (Scopus)


Considerable progress in silicon pressure sensors has been made in recent years. This paper discusses three types of vacuumsealed silicon inicromachined pressure sensors that represent the present state of the art in this important area. The devices are a capacitive vacuum sensor, a surface-micromachined microdiaphragm pressure sensor, and a resonant pressure sensor. Vacuum sealing for these devices is accomplished using anodic bonding, films deposited using low-pressure chemical vapor deposition, and thermal otit-diffusion of hydrogen, respectively. These sensors emphasize high sensitivity, small size, and excellent stability, respectively. The silicon-diaphragm vacuum sensor uses electrostatic force balancing to achieve a wide pressure measurement range.

Original languageEnglish
Pages (from-to)1627-1638
Number of pages12
JournalProceedings of the IEEE
Issue number8
Publication statusPublished - 1998
Externally publishedYes


  • Pressure sensor
  • Silicon micromachining
  • Vacuum seal

ASJC Scopus subject areas

  • Computer Science(all)
  • Electrical and Electronic Engineering


Dive into the research topics of 'Vacuum-sealed silicon micromachined pressure sensors'. Together they form a unique fingerprint.

Cite this