Vacuum-packaged micro fuel reformer for high thermal efficiency and low package temperature

A. Kasuga, S. Tanaka, M. Esashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

A fully-microfabricated wafer-level vacuum package of a micro fuel reformer was designed, fabricated and tested. For thermal insulation, a high-temperature reactor is suspended by microfabricated tubes, in which fuel and reformed gas flow, and is vacuum-packaged by anodic bonding. Conductive heat loss through air in the package was investigated by making the packaging pressure as a parameter. The measured heat loss is 1.2 W at a reforming temperature of 240°C, showing a potential to realize a micro fuel reformer with a thermal efficiency of 75%. Also, the temperature of the package outside is as low as 60°C, which is enough to install the micro fuel reformer in portable electronics.

Original languageEnglish
Title of host publicationMEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems
Pages968-971
Number of pages4
DOIs
Publication statusPublished - 2008 Aug 29
Event21st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2008 Tucson - Tucson, AZ, United States
Duration: 2008 Jan 132008 Jan 17

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Other

Other21st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2008 Tucson
CountryUnited States
CityTucson, AZ
Period08/1/1308/1/17

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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