Vacuum package using anodic bonding assisted by the reflow of low-melting temperature metal

Hoang Manh Chu, Hung Vu Ngoc, Kazuhiro Hane

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)

Abstract

In this paper, we present a highly effective vacuum seal method, which is based on anodic bonding assisted by the reflow of lowmelting temperature metal. To form sacrificial gap for evacuating the packaged cavity before hermetically sealing, the reflow process of Au/Sn/Cr posts due to low-melting temperature Sn metal was introduced. Using this technique to form the evacuation gap, the micro-precise alignment between packaging wafers was obtained. The package method enabled to eliminate contaminant caused by package process. The diaphragm structure sensing pressure was used to investigate the proposed package method. The vacuum level in the packaged cavity was obtained lower than 5 Pa. In comparison to the conventional package method without using the reflow process to form the evacuation gap, the vacuum level has been improved by a factor of 8. The yield and uniformity of the package method were also confirmed to be higher than the conventional package method without using the reflow process to form the evacuation gap. This vacuum package method can be implemented to remove air damping for optimal performance of mechanical oscillators such as accelerometers, gyroscopes, energy harvesters, and micro-mirrors.

Original languageEnglish
Pages (from-to)695-701
Number of pages7
JournalInternational Journal of Precision Engineering and Manufacturing
Volume15
Issue number4
DOIs
Publication statusPublished - 2014 Apr

Keywords

  • Anodic bonding
  • Low-melting temperature metal reflow
  • Vacuum package

ASJC Scopus subject areas

  • Mechanical Engineering
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Vacuum package using anodic bonding assisted by the reflow of low-melting temperature metal'. Together they form a unique fingerprint.

Cite this