Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature

Yingqiong Yong, Mai Thanh Nguyen, Tetsu Yonezawa, Takashi Asano, Masaki Matsubara, Hiroki Tsukamoto, Ying Chih Liao, Tengfei Zhang, Shigehito Isobe, Yuki Nakagawa

Research output: Contribution to journalArticle

17 Citations (Scopus)

Abstract

A method for producing Cu films with low resistivity, based on low temperature sintering, is demonstrated. The Cu inks for preparing conductive Cu films consisted of Cu particles that were coated with a decomposable polymer (poly(propylenecarbonate), PPC) as well as a self-reducible copper formate/1-amino-2-propanol (CuF-IPA) complex as an additive. The sintering temperature used in this study was as low as 100 °C. Following sintering at a temperature of 100 °C, the lowest reported resistivity (8.8 × 10−7 Ω m) was achieved through the use of Cu-based metal-organic decomposition (MOD) inks. This was due to the dual promotional effects of the aminolysis of PPC with IPA and the pyrolysis of the CuF-IPA complex.

Original languageEnglish
Pages (from-to)1033-1041
Number of pages9
JournalJournal of Materials Chemistry C
Volume5
Issue number5
DOIs
Publication statusPublished - 2017 Jan 1
Externally publishedYes

ASJC Scopus subject areas

  • Chemistry(all)
  • Materials Chemistry

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