Use of crn passivation for fabricating Al micro-materials by electromigration

Yasuhiro Kimura, Takahiro Sasaki, Masumi Saka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The technique for fabricating Al micro-materials using a conductive passivation film by electromigration (EM), which is the physical phenomenon of atomic transport with high-density electron flow, has been reported. Conductive passivation film precludes the unplanned hillock formation and substantially simplifies the sample preparation time for fabricating Al micro-materials by EM. To date, TiN that is electrical conductive material has been used as a passivation film. However, the TiN passivation oxidizes during heat and current test for fabricating Al micro-materials by EM because of inherent poor oxidation resistance of TiN. Oxidation of passivation causes a problem that applying current occasionally becomes difficult. The present paper proposes a new conductive passivation made of CrN for fabricating Al micro-materials by EM. CrN is used as a countermeasure against the oxidation problem. Additionally, the growth of Al micro-materials by EM is investigated in the relation with the experimental conditions of current and substrate temperature. As a result, we report that the fabrication of Al micro-materials using the CrN passivation is successfully demonstrated in the relation with the experimental conditions.

Original languageEnglish
Title of host publicationManufacturing and Applied Research
PublisherTrans Tech Publications
Pages67-71
Number of pages5
ISBN (Print)9783038350590
DOIs
Publication statusPublished - 2014
Event2nd International Conference on Manufacturing, Manufacturing 2014 - , Singapore
Duration: 2014 Feb 92014 Feb 10

Publication series

NameAdvanced Materials Research
Volume909
ISSN (Print)1022-6680

Other

Other2nd International Conference on Manufacturing, Manufacturing 2014
Country/TerritorySingapore
Period14/2/914/2/10

Keywords

  • Conductive passivation
  • Current
  • Electromigration
  • Oxidation
  • Substrate temperature

ASJC Scopus subject areas

  • Engineering(all)

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