Underpotential deposition of copper on gold electrodes through self-assembled monolayers of propanethiol

Matsuhiko Nishizawa, Tomohide Sunagawa, Hiroshi Yoneyama

Research output: Contribution to journalArticlepeer-review

86 Citations (Scopus)

Abstract

Electrodeposition of Cu on an Au(111)/mica electrode surface coated with a self-assembled monolayer (SAM) of propanethiol has been studied in a potential region comprising the underpotential deposition (UPD). The UPD of Cu and stripping of the deposited Cu took place reversibly through the SAM layer, and furthermore it was found that the SAM was still present on the electrode surface without significant changes in its amount and structure even after repeating Cu deposition/stripping cycles. The Cu adlayer stabilized the SAM completely toward its reductive desorption in an alkali solution, suggesting that a homogeneous Cu adlayer was formed on the entire electrode surface. A surface structure of the resulting electrode is discussed on the basis of these electrochemical results.

Original languageEnglish
Pages (from-to)5215-5217
Number of pages3
JournalLangmuir
Volume13
Issue number20
DOIs
Publication statusPublished - 1997 Oct 1
Externally publishedYes

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Spectroscopy
  • Electrochemistry

Fingerprint Dive into the research topics of 'Underpotential deposition of copper on gold electrodes through self-assembled monolayers of propanethiol'. Together they form a unique fingerprint.

Cite this